This work explores advanced engineering optimization techniques for minimizing surface roughness in the electrodeposition process, focusing on reducing the difference between the maximum and minimum deposition heights over a selected time span. The study begins with a comprehensive review of relevant literature and an exploration of deposition parameters such as forward current, reverse current, forward time proportion, and solution conductivity and their impact on surface roughness. Using the fundamental understanding of these topics, a mathematical model will be created in COMSOL Multiphysics to simulate a surface defect on a substrate during electrodeposition, evaluating the deposition height difference between the defect peak and the deposition plane. Taguchi analysis was used to create a Design of Experiments and identify the significance of the targeted variables. Assuming a linear relationship between the parameters and the height difference, an objective function was obtained and used to systemically identify the optimal process parameters to minimize the surface roughness of nickel electrodeposition. For a minimum Δy, maximum values of solution conductivity should be paired with minimum values of the forward current, reverse current, and a forward time proportion greater than 0.5. This research contributes to further evolving micromanufacturing processes by providing a framework and systemic approach to enhancing the electroplating process and, in turn, providing valuable insight for advancements in electronics manufacturing, automotive components, and biomedical devices.